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PRODUCT FEATURE	Normal	Special	Cost Optimum
Layers
Minimum	2	0
Maximum	8	14
Board thickness
Minimum	0.8 mm	0.1 mm	1.0 mm
Maximum	3.2 mm		1.6 mm
Inner layer laminate thickness
Minimum	0.15 mm	0.10mm	0.20mm
Maximum	1.10 mm	1.40 mm	0.71 mm
Prepreg thickness*
Type 7628 FR4	0.191 mm		Yes
Type 2113 FR4	0.100mm
Type 2116 FR4	0.110 mm		Yes
Type 1080 FR4	0.071 mm		Yes
NOTE: 2 prepregs as minimum between laminates unless otherwise specified.
Copper thickness
12 micron (1/3 oz)	-	Yes
17.5 micron  (1/2 oz)	Yes		X
35 micron (1 oz)	Yes
70 micron (2 oz)	On request only
105 microns (3 oz)		On request only
PRODUCT FEATURE	Normal	Special	Cost Optimum
Minimum lines and spaces
Line/space inner layers	125 micron For Base Cu thickness	100 microns for base copper thicknes ≤ 17.5 micron	150 microns for base copper thickness ≤ 17.5 microns
	≤ 17.5 micron		175 microns for base copper thickness = 35 microns
	150 microns for base copper thickness 35 microns
Line/space Outer layers	125 micron For Base Cu thickness	100 microns for base copper thicknes ≤ 12 micron	150 microns for base copper thickness ≤ 17.5 microns
	≤ 17.5 micron		175 microns for base copper thickness = 35 microns
	150 microns for base copper thickness = 35 microns
Minimum annular ring, pad diam. / finished hole diam.  (no breakout) / Mecanical drilled
Inner layers	0.42 mm	0.37 mm	0.50 mm
Outer layers	0.35 mm	0.28 mm	0.40 mm
Viaholes minimum ann.ring, pad diam. / finished hole diam.(no breakout)/Mecanical drilled
Inner layers	0.30 mm	0.25 mm
Outer layers	0.24 mm	0.20 mm
Minimum hole diameter after copper plating
Mech. drilled	0.15 mm	0.10 mm	0.40 mm
Holes, tolerance, (diameter D is nominal)
Through plated hole
0.15 ≤ D ≤ 0.5 mm	+ 0.10 / -D mm
0.5 ≤ D ≤ 2.0 mm	± 0.075 mm		± 0.10 mm
D = 2.0 thru 6.0 mm	± 0.10 mm
NOTE 1
Press fit connector Hole D ≤ 3.0 mm
NOTE 2	± 0.05 mm
Non plated hole		+ 0 / - 0.05 mm
D ≤ 6.0 mm	± 0.05 mm	on request only
D > 6.0 mm	± 0.10 mm
NOTE 1: ± 0.050 mm on ENIG/ISn Solder Surface
NOTE 2: After copper plating
PRODUCT FEATURE	Normal	Special	Cost Optimum
Hole copper plating, nominal copper thickness
Via hole minimum
Aspect ratio ≤ 4	25 micron
	NOTE 1
Aspect ratio > 4	18 micron
	NOTE 2
NOTE 1: assumes an average of 6 measurement points, localized down to 18 microns, if required 25
NOTE 2: assumes an average of 6 measurement points, localized down to 12 microns, if required 18
NOTE 3 assumes an average of 6 measurement points, localized down to 13 microns, if required 15
NOTE 4 assumes an average of 6 measurement points, localized down to 10 microns, if required 12
Maximum Aspect Ratio
Laminate thickness/hole	5	6	3
Hole placement
Hole to pattern NOTE 1	± 0.10 mm	± 0.08 mm	± 0.13 mm
Non plated holes drilled in routing program to through holes	± 0.10 mm
			± 0.13 mm
NOTE1: Assumes maximum board dimension 300X300 mm
Solder mask to pattern, placement accuracy and minimum bar
Primary mask	± 0.075 mm	± 0.050 mm	± 0.10 mm
Plug mask NOTE1	± 0.2 mm
Minimum bar width	0.09 mm	0.075 mm	0.10 mm
NOTE: If required holes with D<0.4 mm are plugged, but not completely filled. Placement is relative to hole.
Via plugging
Core thickness	> 0.5 mm		0.80 mm
Screened legend (component annotation) placement accuracy and minimum features
Minimum distance to solder pad	0.20 mm		0.25 mm
Minimum character height	1.20 mm		1.50 mm
Minimum character stroke width	0.20 mm		0.25 mm
PRODUCT FEATURE	Normal	Special	Cost Optimum
Screened carbon polymers for contacts
Minimum bar width	0.3 mm
Minimum spacing carbon to carbon	0.3 mm
Minimum contact area Carbon to copper	0.2 X 0.3 mm
Minimum carbon/copper overlap	0.2 mm
Minimum distance, carbon to conductor	0.5 mm
Minimum distance carbon to solder mask	0.3 mm
Minimum carbon/solder mask overlap	0.3 mm
Carbon thickness	15 - 30 micron
Maximum resistance after climatic test	200 Ohms
Surface treatment
Hot Air Leveling	1-40 microns
Hot Air Leveling(Leadfree)	1-40 microns
Electroless nickel/gold (ENIG)	nickel 4 - 8 microns
	gold 0.05 - 0.20 microns
Immersion tin (ISn)	1.0 - 1.3 microns
OSP	0.2 - 0.5 microns
Hard gold NOTE1	nickel 4 microns minimum gold 1.27 micron minimum	Nickel > 4 microns
		Gold > 1.27 microns
NOTE: Minimum distance between hard gold contacts and hole is 1.0 mm for PCB with hot air leveling and 0.7 mm for PCB with electro less nickel/gold or immersion tin
Peel able mask
Position tolerance	± 0.50 mm		0.75 mm
Minimum area	30 mm2		40 mm2
Minimum feature	3 mm		5 mm
Minimum distance to uncovered pattern	1.0 mm		1.5 mm
Maximum hole diameter for full coverage	1.5 mm		1.2 mm
Routing
Minimum tolerance	± 0.10 mm		± 0.13 mm
Minimum distance routing to pattern	Outer layers 0.20 mm		Outer layers 0.30 mm
	Inner layers 0.40 mm		Inner layers 0.50 mm
PRODUCT FEATURE	Normal	Special	Cost Optimum
Scoring
Minimum positioning tolerance	± 0.1 mm
Angle	30°  / 45°
Tolerance to routing	+0.225 mm
	- 0.20 mm
Contour displacement relative to origin	+ 0.15 mm
	- 0.10 mm
PCB tolerance, 2 scored edges after separation	+ 0.20 mm
	- 0.10 mm
Minimum distance nom. Centerline to pattern/holes	0.50 mm		0.70 mm
Bevel/chamfer
Angles standard	30° and 45°
Angels on request	20° to 60°
Angle tolerance	± 5°		± 10°
Depth tolerance	± 0.10 mm		± 0.20 mm
Minimum Bevel/chamfer travel	45 mm with 10 mm clearance at both ends		45 mm with 20 mm clearances at both ends