Design parameters

 

Among the design parameters are the following. Please use the menu on the left for more parameters:

 

Production processes:

 

Double Side, Multilayer boards 4 to 10 Layers, 0,30 mm to 3,2 mm

100micron/4mil line/space

6:1 Aspect Ratio

Controlled Impedance

Edge Plating

Routing/Counter sink

V-Scoring

Beveling

 

Materials:

 

FR4 (TG140, TG170, Helogen Free, )

RO4003 , ARLON 25FR

Base copper thickness 12 microns to 105 microns

Soldermask Two-Components Liquid Photo Imageable

Peelable Mask

 

Surface finishes:

 

Hot Air Soldering Leveling (HASL)/Lead free HAL

Nickel and Gold, Electroless and Electroplated Selective

Immersion Tin

Carbon Paste